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LT6700CS6-2#TRMPBF - Analog Devices

Description: Linear Technology LT6700CS6-2#TRMPBF Dual Comparator, Open Collector O/P, 2.2μs 1.4 → 18 V 6-Pin TSOT-23

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PCB Footprints
LT6700CS6-2#TRMPBF - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - S6 Package 6-Lead Plastic TSOT-23  LTC DWG # 05-08-1636
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3D Models
LT6700CS6-2#TRMPBF - Analog Devices  - 3D model - SOT23 (6-Pin) - S6 Package 6-Lead Plastic TSOT-23  LTC DWG # 05-08-1636
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LT6700CS6-2#TRMPBF Details

  • Manufacturer Part Number:

    LT6700CS6-2#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    05-08-1636

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.015 µA

  • Bias Current-Max (IIB) @25C:

    0.01 µA

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    70 °C

  • Output Type:

    OPEN-COLLECTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    29000 ns

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.016 mA

  • Supply Voltage Limit-Max:

    18.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

LT6700CS6-2#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6700CS6-2 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor is of high quality and has a low ESR. Additionally, the input capacitor should be placed close to the device and have a low ESL.
  • The maximum ambient temperature range for the LT6700CS6-2 is -40°C to 125°C. However, the device can operate at a junction temperature of up to 150°C.
  • Yes, the LT6700CS6-2 is suitable for high-reliability applications. It is manufactured using a proprietary BiCMOS process and has undergone rigorous testing to ensure its reliability. However, it is essential to follow proper design and manufacturing guidelines to ensure the device operates within its specified parameters.
  • To troubleshoot issues with the LT6700CS6-2, start by checking the input and output voltages, as well as the device's operating frequency. Verify that the component values and PCB layout meet the recommended guidelines. Use an oscilloscope to check for oscillations or other anomalies. If the issue persists, consult the datasheet and application notes or contact Analog Devices' technical support.

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LT6700CS6-2#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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