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LT6703HVCS5-2#TRPBF - Analog Devices

Description: Analog Comparators Micropower, Low Voltage Comparator with 400mV Reference

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LT6703HVCS5-2#TRPBF - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - LT6703HVCS5-2#TRPBF-ap
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LT6703HVCS5-2#TRPBF Details

  • Manufacturer Part Number:

    LT6703HVCS5-2#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MO-193, TSOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    05-08-1635

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.01 µA

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    29000 ns

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage Limit-Max:

    18.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

LT6703HVCS5-2#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6703HVCS5-2 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure stability, it's essential to follow the recommended compensation network and component values, as well as to maintain a low impedance output and a stable input voltage. Additionally, the device's output should be decoupled with a capacitor, and the input should be filtered to prevent high-frequency noise.
  • The LT6703HVCS5-2 is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. It's essential to ensure that the device's junction temperature does not exceed 150°C.
  • Yes, the LT6703HVCS5-2 is suitable for high-reliability and aerospace applications. It's manufactured using a high-reliability process, and it's available in a variety of screening levels, including JANS (Joint Army-Navy Specification) and ESCC (European Space Components Coordination) qualified versions.
  • To troubleshoot issues with the LT6703HVCS5-2, start by verifying the device's input and output voltages, as well as the output current. Check for any signs of overheating, and ensure that the device is properly decoupled and filtered. If the issue persists, consult the datasheet and application notes, or contact Analog Devices' technical support.

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LT6703HVCS5-2#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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