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LT8364HDE#TRPBF - Analog Devices

Description: Low IQ Boost/SEPIC/Inverting Converter with 4A, 60V Switch

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LT8364HDE#TRPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 12-Lead Plastic DFN (4mm × 3mm)
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LT8364HDE#TRPBF - Analog Devices  - 3D model - Small Outline No-lead - 12-Lead Plastic DFN (4mm × 3mm)
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LT8364HDE#TRPBF Details

  • Manufacturer Part Number:

    LT8364HDE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1695

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    IT CAN ALSO CONFIGURED AS INVERTING OR SEPIC CONVERTER

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE SKIP MODE

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    2.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    2150 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LT8364HDE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8364HDE involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The compensation network for the LT8364HDE can be optimized by following the guidelines in the datasheet and using the provided compensation calculator tool. The tool helps to calculate the values of the compensation components based on the input and output voltage, output current, and other parameters.
  • The maximum junction temperature for the LT8364HDE is 150°C. It is recommended to keep the junction temperature below 125°C for reliable operation and to ensure a long lifespan for the device.
  • Yes, the LT8364HDE is rated for operation up to 125°C, making it suitable for high-temperature environments. However, it is essential to ensure that the device is properly heatsinked and that the junction temperature is kept within the recommended limits.
  • The LT8364HDE has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, additional protection can be added using external components such as TVS diodes and voltage supervisors to ensure that the device is protected from voltage transients and faults.

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LT8364HDE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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