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LTC1541IMS8#TRPBF - Analog Devices

Description: Comparator Single R-R O/P ±6.3V/12.6V Automotive 8-Pin MSOP T/R

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LTC1541IMS8#TRPBF - Analog Devices - PCB symbol
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LTC1541IMS8#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 8-Lead Plastic- MSOP
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LTC1541IMS8#TRPBF - Analog Devices - 3D model - Small Outline Packages - MS8 8-Lead Plastic- MSOP
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LTC1541IMS8#TRPBF Details

  • Manufacturer Part Number:

    LTC1541IMS8#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    CAN ALSO OPERATE WITH 5V SUPPLY

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    12.6 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC1541IMS8#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1541IMS8 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout and land pattern that should be followed.
  • To ensure accurate temperature measurement, it's essential to follow proper thermal design practices. This includes ensuring good thermal contact between the device and the PCB, using a thermally conductive material for the PCB, and minimizing thermal gradients. Additionally, the device should be calibrated to account for any thermal offsets or nonlinearities.
  • The maximum clock frequency that can be used with the LTC1541IMS8 is 1.5MHz. However, it's recommended to use a clock frequency of 1MHz or less to ensure reliable operation and minimize noise susceptibility.
  • Yes, the LTC1541IMS8 can be used in a multi-drop bus configuration. However, it's essential to ensure that the bus capacitance is within the recommended limits (less than 400pF) and that the bus is properly terminated to prevent signal reflections and noise.
  • The LTC1541IMS8 has a built-in power-on reset (POR) circuit that ensures the device is in a known state after power-up. To handle the POR, it's recommended to use a power supply with a slow rise time (typically 10ms or more) and to ensure that the device is properly decoupled with bypass capacitors.

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LTC1541IMS8#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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