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LTC1590CS#PBF - Analog Devices

Description: Linear Technology LTC1590CS#PBF, 2-channel 12 bit Serial DAC, 16-Pin SOIC

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LTC1590CS#PBF - Analog Devices - PCB symbol
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LTC1590CS#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Plastic Small Outline (Narrow 0.150)
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LTC1590CS#PBF - Analog Devices - 3D model - Small Outline Packages - 16-Lead Plastic Small Outline (Narrow 0.150)
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LTC1590CS#PBF Details

  • Manufacturer Part Number:

    LTC1590CS#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, PLASTIC, SO-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1610 (S16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, OFFSET BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Linearity Error-Max (EL):

    0.0122%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Nom (tstl):

    0.3 µs

  • Supply Current-Max:

    0.01 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

LTC1590CS#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC1590CS involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the power supply bypass capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability and prevent oscillation, ensure that the output capacitor is properly sized, the input and output traces are properly routed, and the device is properly bypassed with capacitors. Additionally, avoid using long input traces and keep the device away from noise sources.
  • The maximum input voltage that the LTC1590CS can handle is 15V. Exceeding this voltage can cause damage to the device.
  • The LTC1590CS is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's performance and consider using a heat sink or thermal management system in high-temperature environments.
  • To troubleshoot issues with the LTC1590CS, start by checking the input and output voltages, ensuring that the device is properly powered and bypassed. Check for signs of overheating, and verify that the device is properly soldered and connected. Use an oscilloscope to check for oscillations or noise on the output.

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LTC1590CS#PBF Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like LTC15, or try a keyword search, such as Digital to Analog Converters

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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