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LTC1867LIGN#TRPBF - Analog Devices

Description: Micropower, 3V, 16-Bit, 8-Channel 175ksps ADCs

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LTC1867LIGN#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC1867LIGN#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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3D Models
LTC1867LIGN#TRPBF - Analog Devices - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP (Narrow .150 Inch)
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LTC1867LIGN#TRPBF Details

  • Manufacturer Part Number:

    LTC1867LIGN#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    1.25 V

  • Analog Input Voltage-Min:

    -1.25 V

  • Conversion Time-Max:

    3.7 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Linearity Error-Max (EL):

    0.0061%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.175 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2.7 mA

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LTC1867LIGN#TRPBF Frequently Asked Questions (FAQs)

  • A good layout and placement for the LTC1867LIGN#TRPBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane and to keep the digital signals away from the analog signals.
  • To ensure the LTC1867LIGN#TRPBF operates within its specified temperature range, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, ensuring good airflow, and keeping the device away from other heat sources.
  • Not using the recommended bypass capacitors for the LTC1867LIGN#TRPBF can lead to reduced noise rejection, increased noise sensitivity, and potential oscillations. It's essential to use the recommended bypass capacitors to ensure the device operates within its specified performance.
  • To troubleshoot issues with the LTC1867LIGN#TRPBF, start by verifying the power supply voltage, checking for proper grounding and shielding, and ensuring the device is operated within its specified temperature range. Also, check the input signals, output loads, and PCB layout for any potential issues.
  • Exceeding the maximum ratings for the LTC1867LIGN#TRPBF can lead to permanent damage to the device, reduced reliability, and potentially catastrophic failure. It's essential to operate the device within its specified maximum ratings to ensure reliable operation and prevent damage.

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LTC1867LIGN#TRPBF Overview

Use the download button to access the LTC1867LIGN#TRPBF schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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