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LTC1923EGN#TRPBF - Analog Devices

Description: Power Management Specialized - PMIC Hi Eff Thermoelectric Cooler Cntr

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LTC1923EGN#TRPBF - Analog Devices - PCB symbol
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LTC1923EGN#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN (28-Lead SSOP)
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LTC1923EGN#TRPBF - Analog Devices - 3D model - Small Outline Packages - GN (28-Lead SSOP)
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LTC1923EGN#TRPBF Details

  • Manufacturer Part Number:

    LTC1923EGN#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, PLASTIC, SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1641 (GN28)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    4 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    270 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9116 mm

LTC1923EGN#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1923EGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To optimize the performance of the LTC1923EGN, ensure that the input and output capacitors are of high quality and have low ESR, use a low-impedance power source, and minimize the distance between the device and the input/output capacitors. Additionally, ensure that the PCB layout is well-designed and the device is properly decoupled.
  • The maximum ambient temperature range for the LTC1923EGN is -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • Yes, the LTC1923EGN is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure that it meets the requirements of the automotive and industrial markets.
  • To troubleshoot issues with the LTC1923EGN, start by checking the input and output voltages, ensuring that they are within the recommended range. Check the PCB layout for any errors or noise issues, and verify that the device is properly decoupled. If the issue persists, consult the datasheet and application notes for further guidance.

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LTC1923EGN#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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