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LTC1966CMS8#PBF - Analog Devices

Description: IC, SM, RMS TO DC, PREC

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LTC1966CMS8#PBF - Analog Devices - PCB symbol
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LTC1966CMS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic MSOP-1
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LTC1966CMS8#PBF - Analog Devices - 3D model - Small Outline Packages - 8-Lead Plastic MSOP-1
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LTC1966CMS8#PBF Details

  • Manufacturer Part Number:

    LTC1966CMS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Converter Type:

    RMS TO DC CONVERTER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.15%

  • Moisture Sensitivity Level:

    1

  • Negative Input Voltage-Max:

    -5.5 V

  • Negative Supply Voltage-Max:

    -5.5 V

  • Negative Supply Voltage-Nom:

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Frequency-Max:

    0.8 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Positive Input Voltage-Max:

    5.5 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC1966CMS8#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC1966CMS8 involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing the device close to the analog power supply. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To optimize the performance of the LTC1966CMS8 in a noisy environment, use shielding, filtering, and decoupling to reduce electromagnetic interference (EMI) and radio-frequency interference (RFI). Use a low-pass filter at the input and a ferrite bead or a common-mode choke to filter out high-frequency noise.
  • The maximum operating temperature range for the LTC1966CMS8 is -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, and the user should consult the datasheet for specific temperature-related specifications.
  • Yes, the LTC1966CMS8 can be used with a single-supply voltage. However, the device's performance may be affected, and the user should consult the datasheet for specific single-supply voltage operation guidelines.
  • To troubleshoot common issues with the LTC1966CMS8, check the power supply voltage, input signal integrity, and output loading. Verify that the device is properly connected and that the input and output signals are within the specified ranges. Consult the datasheet and application notes for specific troubleshooting guidelines.

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LTC1966CMS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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