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LTC2754BCUKG-16#PBF - Analog Devices

Description: IC DAC 16BIT QUAD IOUT 52-QFN

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LTC2754BCUKG-16#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - Package 52-Lead Plastic QFN (7mm × 8mm)-1
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LTC2754BCUKG-16#PBF - Analog Devices  - 3D model - Quad Flat No-Lead - Package 52-Lead Plastic QFN (7mm × 8mm)-1
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LTC2754BCUKG-16#PBF Details

  • Manufacturer Part Number:

    LTC2754BCUKG-16#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    7 X 8 MM, LEAD FREE, PLASTIC, QFN-52

  • Pin Count:

    52

  • Manufacturer Package Code:

    05-08-1729

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Output Voltage-Max:

    10 V

  • Analog Output Voltage-Min:

    -10 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PQCC-N52

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Linearity Error-Max (EL):

    0.0031%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    52

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Settling Time-Nom (tstl):

    2 µs

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

LTC2754BCUKG-16#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2754BCUKG-16#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the bypass capacitors. Additionally, it's recommended to use a symmetrical layout for the differential pairs and to keep the signal traces away from the power traces.
  • To ensure proper powering and bypassing of the LTC2754BCUKG-16#PBF, use a high-quality, low-ESR bypass capacitor (e.g., 10uF ceramic capacitor) between the VCC and GND pins, and place it as close to the device as possible. Additionally, use a separate power supply for the analog and digital sections, and ensure that the power supply is clean and well-regulated.
  • The maximum clock frequency that can be used with the LTC2754BCUKG-16#PBF is 50MHz. However, the actual clock frequency limit may be lower depending on the specific application and the quality of the clock signal.
  • To handle thermal management of the LTC2754BCUKG-16#PBF, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow with other components. Additionally, consider using a thermal interface material (e.g., thermal tape or thermal grease) between the device and the heat sink to improve heat transfer.
  • The recommended termination scheme for the differential pairs of the LTC2754BCUKG-16#PBF is to use a 100Ω differential termination resistor at the receiving end of the transmission line. This helps to match the impedance of the transmission line and reduce reflections and signal degradation.

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LTC2754BCUKG-16#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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