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LTC3531ES6-3#TRMPBF - Analog Devices

Description: 200mA Buck-Boost Synchronous DC/DC Converters

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LTC3531ES6-3#TRMPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC3531ES6-3#TRMPBF - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6-Lead Plastic TSOT-23
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LTC3531ES6-3#TRMPBF - Analog Devices - 3D model - SOT23 (6-Pin) - 6-Lead Plastic TSOT-23
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LTC3531ES6-3#TRMPBF Details

  • Manufacturer Part Number:

    LTC3531ES6-3#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MO-193, TSOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    05-08-1636

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.8 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    0.46 A

  • Output Voltage-Max:

    3.09 V

  • Output Voltage-Min:

    2.95 V

  • Output Voltage-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

LTC3531ES6-3#TRMPBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the LTC3531ES6-3 can be found in the application note AN113, which provides guidelines for layout, component placement, and thermal management to ensure optimal performance and minimize noise.
  • The selection of the right inductor for the LTC3531ES6-3 depends on the specific application requirements, such as the input voltage, output voltage, and switching frequency. A good starting point is to use the inductor selection guide provided in the datasheet, and then verify the selection using the LTpowerCAD design tool.
  • The maximum ambient temperature for the LTC3531ES6-3 is 85°C, but it can be derated for higher temperatures. It's essential to consider the thermal management and heat dissipation in the system design to ensure reliable operation.
  • Yes, the LTC3531ES6-3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is also suitable for industrial and medical applications that require high reliability.
  • To troubleshoot issues with the LTC3531ES6-3, start by verifying the PCB layout, component values, and soldering quality. Then, use an oscilloscope to measure the input and output voltages, and check for any signs of oscillation or instability. The datasheet and application notes provide guidance on troubleshooting and debugging techniques.

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LTC3531ES6-3#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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