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LTC6254IMS#TRPBF - Analog Devices

Description: IC OPAMP GP 720MHZ RRO 16MSOP

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LTC6254IMS#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 Lead  MS Package
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LTC6254IMS#TRPBF Details

  • Manufacturer Part Number:

    LTC6254IMS#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1669

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.7 µA

  • Bias Current-Max (IIB) @25C:

    2.5 µA

  • Common-mode Reject Ratio-Min:

    77 dB

  • Common-mode Reject Ratio-Nom:

    105 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1400 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    170 V/us

  • Supply Current-Max:

    22 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    630000

  • Voltage Gain-Min:

    1800

  • Wideband:

    YES

  • Width:

    3 mm

LTC6254IMS#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6254 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer board with a dedicated analog ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, use a stable input voltage, and avoid capacitive loads. Also, ensure that the output is not overloaded and that the device is operated within its specified temperature range.
  • The LTC6254 can drive up to 100nF of capacitive load. However, it's recommended to limit the capacitive load to 10nF or less to ensure stability and optimal performance.
  • Yes, the LTC6254 can be used as a unity-gain buffer. However, it's essential to ensure that the input and output are properly terminated, and the device is operated within its specified bandwidth and slew rate.
  • To reduce noise and EMI, use a low-noise power supply, add bypass capacitors, and use shielding or guard rings around the device. Also, keep the input and output traces short and away from each other, and avoid running digital signals near the analog signals.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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