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LTC6811HG-2#TRPBF - Analog Devices

Description: Battery Management Multicell Battery Stack Monitor with Addressable isoSPI Interface

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LTC6811HG-2#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - G Package 48-Lead Plastic SSOP (5.3mm)-ren1
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LTC6811HG-2#TRPBF - Analog Devices - 3D model - Small Outline Packages - G Package 48-Lead Plastic SSOP (5.3mm)-ren1
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LTC6811HG-2#TRPBF Details

  • Manufacturer Part Number:

    LTC6811HG-2#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    05-08-1887

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    BATTERY MONITOR

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    55 V

  • Supply Voltage-Min (Vsup):

    11 V

  • Supply Voltage-Nom (Vsup):

    40 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

LTC6811HG-2#TRPBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a star topology for the analog signals and keep the sensitive analog traces away from the digital traces.
  • Calibration involves adjusting the gain and offset of the ADCs. Use the internal calibration registers to adjust the gain and offset. Perform a self-test to verify the calibration. Refer to the datasheet for the calibration procedure and equations.
  • Up to 12 devices can be daisy-chained together using the SPI interface. However, the maximum number of devices that can be connected depends on the system's noise tolerance and the quality of the PCB layout.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow. Monitor the device temperature using the internal temperature sensor and take corrective action if the temperature exceeds the specified range.
  • Power up the device in the following sequence: VCC, AVCC, and then the digital power supply. Ensure that the power supplies are stable and within the specified range before enabling the device.

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LTC6811HG-2#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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