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LTC6820IMS#PBF - Analog Devices

Description: isoSPI Isolated Communications Interface, Ultralow, 2µA Idle Current, 2.7V to 5.5V Power Supply, 16-Lead MSOP

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LTC6820IMS#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 Lead Plastic MSOP
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LTC6820IMS#PBF - Analog Devices  - 3D model - Small Outline Packages - 16 Lead Plastic MSOP
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LTC6820IMS#PBF Details

  • Manufacturer Part Number:

    LTC6820IMS#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1669

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC6820IMS#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6820IMS#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog layer to minimize noise and crosstalk.
  • The LTC6820IMS#PBF requires a single 3.3V or 5V power supply. It's recommended to use a low-noise, low-dropout regulator (LDO) to power the device. Power sequencing is not critical, but it's recommended to power up the device after the power supply has stabilized.
  • The LTC6820IMS#PBF can achieve data rates up to 100 Mbps. However, the maximum data rate is limited by the quality of the transmission line, the signal-to-noise ratio, and the clock jitter. It's recommended to use a high-quality transmission line and to follow proper PCB layout guidelines to minimize signal degradation.
  • To troubleshoot common issues with the LTC6820IMS#PBF, start by checking the power supply voltage and ensuring it's within the recommended range. Next, verify that the device is properly configured and that the transmission line is properly terminated. Use an oscilloscope to check the signal integrity and look for signs of signal degradation or noise. If issues persist, consult the datasheet and application notes for further guidance.
  • The LTC6820IMS#PBF has a maximum junction temperature of 150°C. To ensure proper heat dissipation, use a heat sink or a thermal pad on the exposed pad of the device. Ensure good airflow around the device and avoid blocking the airflow. It's also recommended to use a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.

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LTC6820IMS#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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