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LTC7000EMSE#PBF - Analog Devices

Description: Gate Drivers Fast 150V Protected High Side NMOS Static Switch Driver

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LTC7000EMSE#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC7000EMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Plastic MSOP **-
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3D Models
LTC7000EMSE#PBF - Analog Devices - 3D model - Small Outline Packages - 16-Lead Plastic MSOP **-
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LTC7000EMSE#PBF Details

  • Manufacturer Part Number:

    LTC7000EMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.19,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.085 mA

  • Supply Voltage-Max:

    135 V

  • Supply Voltage-Min:

    3.5 V

  • Supply Voltage-Nom:

    10 V

  • Supply Voltage1-Max:

    135 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.07 µs

  • Turn-on Time:

    0.07 µs

  • Width:

    3 mm

LTC7000EMSE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC7000EMSE#PBF involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and ensure optimal performance.
  • To ensure the LTC7000EMSE#PBF is properly biased, make sure to connect the VCC pin to a stable voltage source, and the GND pin to a solid ground plane. Also, ensure that the input voltage is within the recommended range of 2.7V to 5.5V, and that the output is properly terminated with a 50Ω load.
  • The LTC7000EMSE#PBF can achieve data rates of up to 6.4Gbps, making it suitable for high-speed applications such as HDMI, DisplayPort, and PCIe.
  • To troubleshoot issues with the LTC7000EMSE#PBF, use a combination of oscilloscopes, signal generators, and logic analyzers to analyze the input and output signals. Also, check the power supply voltage and noise levels to ensure they are within the recommended specifications.
  • The LTC7000EMSE#PBF is rated for operation from -40°C to 125°C, making it suitable for use in high-temperature environments. However, it's recommended to derate the device's performance and power consumption at higher temperatures to ensure reliable operation.

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LTC7000EMSE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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