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LTC7001HMSE#TRPBF - Analog Devices

Description: n Wide Operating VIN: Up to 135V (150V Abs Max) n 1Ω Pull-Down, 2.2Ω Pull-Up for Fast Turn-On and Turn-Off Times with 35ns Propagation Delays n Internal Charge Pump for 100% Duty Cycle n Adjustable Turn-On Slew Rate n Gate Driver Supply from 3.5V to 15V n Adjustable VIN Overvoltage Lockout n Adjustable Driver Supply VCC Undervoltage Lockout n CMOS Compatible Input n Thermally Enhanced, High Voltage Capable 10-Lead MSOP Package

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LTC7001HMSE#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LTC7001HMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)-1
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3D Models
LTC7001HMSE#TRPBF - Analog Devices - 3D model - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)-1
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LTC7001HMSE#TRPBF Details

  • Manufacturer Part Number:

    LTC7001HMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage-Max:

    135 V

  • Supply Voltage-Nom:

    10 V

  • Supply Voltage1-Max:

    135 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    70 µs

  • Turn-on Time:

    70 µs

  • Width:

    3 mm

LTC7001HMSE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC7001HMSE#TRPBF involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down, the device should be powered up and down slowly (typically 1-10ms) to prevent voltage spikes and overshoots. Additionally, the input voltage should be ramped up and down monotonically to prevent oscillations.
  • The recommended input capacitance value is 10nF to 100nF, and the recommended output capacitance value is 10nF to 100nF. However, the optimal value may vary depending on the specific application and operating conditions.
  • To minimize EMI and EMS, use a shielded enclosure, keep the device away from noise sources, use a common-mode choke on the input, and use a ferrite bead on the output. Additionally, ensure good PCB layout practices, such as keeping traces short and using a solid ground plane.
  • The thermal derating of the LTC7001HMSE#TRPBF is typically 1.5°C/W above 25°C. This means that for every 1°C increase in ambient temperature above 25°C, the maximum power dissipation of the device should be derated by 1.5W.

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LTC7001HMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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