Please enter a minimum 3 letters or numbers
Technical Content
Part Image

LTC7003HMSE#TRPBF - Analog Devices

Description: Fast 60V Protected High Side NMOS Static Switch Driver

Download LTC7003HMSE#TRPBF Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
LTC7003HMSE#TRPBF - Analog Devices - PCB symbol
click to zoom
PCB Footprints
LTC7003HMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F)
click to zoom
3D Models
LTC7003HMSE#TRPBF - Analog Devices - 3D model - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F)
click to zoom

LTC7003HMSE#TRPBF Details

  • Manufacturer Part Number:

    LTC7003HMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.085 mA

  • Supply Voltage-Max:

    60 V

  • Supply Voltage-Min:

    3.5 V

  • Supply Voltage-Nom:

    10 V

  • Supply Voltage1-Max:

    60 V

  • Supply Voltage1-Min:

    3.5 V

  • Supply Voltage1-Nom:

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.07 µs

  • Turn-on Time:

    0.07 µs

  • Width:

    3 mm

LTC7003HMSE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC7003HMSE#TRPBF involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down, the device should be powered up and down slowly (typically 1-10ms) to prevent voltage spikes and overshoots. Additionally, the input voltage should be ramped up and down monotonically to prevent oscillations.
  • The recommended input capacitance value is 10nF to 100nF, and the recommended output capacitance value is 10nF to 100nF. X5R or X7R ceramic capacitors are recommended due to their low ESR and high reliability.
  • To minimize EMI and EMS, use a shielded enclosure, keep the device away from high-frequency sources, use a common-mode choke on the input, and use a ferrite bead on the output. Additionally, ensure good PCB layout practices, such as keeping traces short and using a solid ground plane.
  • The thermal derating of the LTC7003HMSE#TRPBF is typically 1.5°C/W. To ensure proper thermal management, use a heat sink with a thermal resistance of less than 10°C/W, and ensure good airflow around the device. Additionally, use a thermal interface material (TIM) with a thermal conductivity of at least 1W/m-K.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

LTC7003HMSE#TRPBF Overview

Use the download button to access the LTC7003HMSE#TRPBF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LTC70, or try a keyword search, such as MOSFET Drivers

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

Parts related to LTC7003HMSE#TRPBF

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑