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LTM2882HY-5#PBF - Analog Devices

Description: Linear Technology LTM2882HY-5#PBF, Cable Transceiver, 2 (RS232)-TRX 10MBps, 32-Pin BGA

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LTM2882HY-5#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 32-Lead (15mm × 11.25mm × 3.42mm)-ren1
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LTM2882HY-5#PBF - Analog Devices  - 3D model - BGA - BGA Package 32-Lead (15mm × 11.25mm × 3.42mm)-ren1
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LTM2882HY-5#PBF Details

  • Manufacturer Part Number:

    LTM2882HY-5#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-F; TIA-232-F

  • JESD-30 Code:

    R-PBGA-B32

  • Length:

    15 mm

  • Number of Functions:

    2

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Receive Delay-Max:

    400 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    3.62 mm

  • Supply Current-Max:

    25 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transmit Delay-Max:

    500 ns

  • Width:

    11.25 mm

LTM2882HY-5#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTM2882HY-5 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces carrying high-frequency signals.
  • To ensure proper powering and decoupling of the LTM2882HY-5, use a high-quality power supply with low noise and ripple, and decouple the device with a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed as close as possible to the device's power pins.
  • The maximum cable length supported by the LTM2882HY-5 depends on the specific application and the type of cable used. However, as a general rule, the device can support cable lengths of up to 10 meters at data rates of up to 100 Mbps, and up to 3 meters at data rates of up to 1 Gbps.
  • To configure the LTM2882HY-5 for hot swap and fault detection, connect the device's FAULT pin to a microcontroller or other monitoring device, and use the device's built-in fault detection circuitry to detect overcurrent, overvoltage, and undervoltage conditions. Additionally, use the device's hot swap controller to control the power-up and power-down sequencing of the system.
  • The thermal derating of the LTM2882HY-5 is typically around 1.5°C/W, which means that the device's maximum power dissipation will decrease by 1.5°C for every 1W of power dissipation above the maximum rated power dissipation.

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LTM2882HY-5#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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