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LTM8040IV#PBF - Analog Devices

Description: 36V, 1A, 13W µModule LED Driver and Current Source 66-LGA 15.0mm x 9.0mm x 4.3mm -40°C ~ 125°C

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LTM8040IV#PBF - Analog Devices PCB footprint - Other - Other - LTM8040IV#PBF-3
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LTM8040IV#PBF - Analog Devices  - 3D model - Other - LTM8040IV#PBF-3
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LTM8040IV#PBF Details

  • Manufacturer Part Number:

    LTM8040IV#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    15 X 9 MM, 4.32 MM HEIGHT, ROHS COMPLIANT, MO-222, LGA-66

  • Pin Count:

    66

  • Manufacturer Package Code:

    05-08-1810

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PBGA-N66

  • JESD-609 Code:

    e4

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    66

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LGA

  • Package Equivalence Code:

    LGA66,7X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.32 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LTM8040IV#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • The input and output capacitors, as well as the PCB layout, have a significant impact on noise performance. Use high-quality, low-ESR capacitors and ensure a well-designed PCB layout to minimize noise.
  • Optimize the input voltage, output voltage, and switching frequency to minimize losses. Use a high-efficiency inductor and ensure proper thermal management to reduce losses.
  • Use a common-mode choke and a differential-mode filter to reduce EMI emissions. Ensure that the PCB layout and component selection comply with regulatory standards such as CISPR and FCC.

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LTM8040IV#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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