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LTM8045EY#PBF - Analog Devices

Description: Linear Technology LTM8045EY#PBF, Dual, Boost/Buck Converter Inverting 700mA, Adjustable, ±2.5 → ±15 V, 2200 kHz

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LTM8045EY#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 40-Lead (11.25mm × 6.25mm × 4.92mm)
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LTM8045EY#PBF - Analog Devices  - 3D model - BGA - BGA Package 40-Lead (11.25mm × 6.25mm × 4.92mm)
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LTM8045EY#PBF Details

  • Manufacturer Part Number:

    LTM8045EY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    40

  • Manufacturer Package Code:

    05-08-1867

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM -2.5V TO 2.5V AND -15V TO 15V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    2.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PBGA-B40

  • JESD-609 Code:

    e1

  • Length:

    11.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA40,5X8,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    5.12 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2200 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.25 mm

LTM8045EY#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI) and reduce noise. Ensure proper PCB layout and component placement to minimize noise coupling.
  • Optimize the input and output capacitors for minimum equivalent series resistance (ESR), use a high-frequency switching frequency, and ensure proper thermal management to minimize losses.
  • Ensure a low thermal resistance path from the device to the heat sink or thermal pad, use thermal interface materials (TIMs) to minimize thermal resistance, and consider using a heat sink with a high thermal conductivity material.

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LTM8045EY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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