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LTM8057MPY#PBF - Analog Devices

Description: 3.1VIN to 31VIN Isolated μModule (Power Module) DC/DC Converter

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LTM8057MPY#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 38-Lead (11.25mm × 9.00mm × 4.92mm)
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LTM8057MPY#PBF - Analog Devices  - 3D model - BGA - BGA Package 38-Lead (11.25mm × 9.00mm × 4.92mm)
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LTM8057MPY#PBF Details

  • Manufacturer Part Number:

    LTM8057MPY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    05-08-1925

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 2.5 VOLT TO 12 VOLT

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    VARIABLE FREQUENCY

  • Input Voltage-Max:

    31 V

  • Input Voltage-Min:

    3.1 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PBGA-B38

  • JESD-609 Code:

    e1

  • Length:

    11.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.44 A

  • Output Voltage-Max:

    12 V

  • Output Voltage-Min:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    5.12 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Technology:

    HYBRID

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

LTM8057MPY#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI). Ensure that the layout and component placement minimize radiation and coupling.
  • Use a low-noise, high-PSRR LDO regulator, and ensure that the input and output capacitors are properly selected and placed to minimize noise and ripple. Additionally, use a quiet voltage reference and a low-noise clock source.
  • Ensure good thermal contact between the device and the heat sink, and use thermal interface materials (TIMs) to minimize thermal resistance. Also, consider the airflow and convection around the heat sink to optimize heat dissipation.

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LTM8057MPY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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