ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rating.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. Refer to the ROHM soldering guidelines for more information.
Yes, the LTR18EZPF24R0 is designed to withstand vibrations up to 10G. However, it is recommended to follow proper mounting and soldering techniques to ensure reliable operation. Additionally, consider using a vibration-resistant mounting method such as a screw-down or adhesive mounting.
ROHM recommends storing the LTR18EZPF24R0 in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the component in direct sunlight or near heat sources.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
LTR18EZPF24R0 Overview
Use the download button to access the LTR18EZPF24R0 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LTR18,
or try a keyword search, such as Fixed Resistors
