ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliability, follow the recommended operating temperature range, use a suitable thermal interface material, and avoid overheating during soldering. Also, consider using a thermally conductive adhesive or thermal tape to improve heat dissipation.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. Avoid exceeding the recommended temperature and time to prevent damage.
Yes, the LTR18EZPF3601 is designed to operate in humid environments. However, it's essential to follow proper packaging and handling procedures to prevent moisture ingress. Consider using a moisture-resistant coating or conformal coating to protect the device.
Store the device in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
LTR18EZPF3601 Overview
Use the download button to access the LTR18EZPF3601 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like LTR18,
or try a keyword search, such as Fixed Resistors
