ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less. Refer to the ROHM soldering guidelines for more information.
Yes, the LTR18EZPJ162 is designed to withstand vibrations up to 10G. However, it is recommended to follow proper mounting and soldering techniques to ensure reliable operation. Additionally, consider using a vibration-resistant mounting method such as a screw or adhesive.
ROHM recommends following proper ESD handling procedures, including using an ESD wrist strap or mat, and storing the components in an ESD-protected environment. The LTR18EZPJ162 has an internal ESD protection diode, but external ESD protection measures are still recommended.
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LTR18EZPJ162 Overview
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