MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to improve heat dissipation.
The device requires a bias tee or a DC block to provide the correct voltage and current. A bias voltage of 5V and a current of 100mA is recommended. The bias circuit should be designed to provide a low impedance path to ground.
The input and output of the device should be matched to 50 ohms using a pi-network or a T-network topology. The matching network should be designed to provide a return loss of at least 15dB.
The device is sensitive to ESD, so it's essential to handle it in an ESD-controlled environment. Use ESD-safe materials, and ensure that all personnel handling the device are grounded using wrist straps or heel straps.
The device should be stored in a dry, cool place, away from direct sunlight. It should be handled using ESD-safe materials, and should not be exposed to temperatures above 150°C or below -40°C.
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MABA-010245-CT1160 Overview
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