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MAX12931EASA+ - Analog Devices

Description: Digital Isolators 2-Channel, 3.75kVRMS Digital Isolators

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MAX12931EASA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8MS-22_
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MAX12931EASA+ - Analog Devices  - 3D model - Small Outline Packages - S8MS-22_
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MAX12931EASA+ Details

  • Manufacturer Part Number:

    MAX12931EASA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2016-09-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX12931EASA+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX12931EASA+ is to use a 4-layer board with a solid ground plane, and to keep the analog and digital signals separate to minimize noise and interference. Additionally, it is recommended to use a low-ESR capacitor for the VCC pin and to place the decoupling capacitors close to the device.
  • To optimize the performance of the MAX12931EASA+ in a noisy environment, it is recommended to use a low-pass filter on the input signals, to use a shielded cable for the analog input signals, and to place the device away from sources of electromagnetic interference (EMI). Additionally, it is recommended to use a common-mode filter on the input signals to reduce common-mode noise.
  • The maximum operating temperature range for the MAX12931EASA+ is -40°C to +125°C. However, it is recommended to operate the device within the specified operating temperature range of -20°C to +85°C for optimal performance and reliability.
  • The MAX12931EASA+ can be programmed using the SPI interface. The device has a set of registers that can be written to configure the device for a specific application. The programming sequence typically involves writing to the configuration registers, setting the gain and offset, and enabling the analog-to-digital converter (ADC). The specific programming sequence may vary depending on the application and the desired performance.
  • The typical power consumption of the MAX12931EASA+ is 12mW at a supply voltage of 3.3V and a sampling rate of 100ksps. However, the actual power consumption may vary depending on the specific application, the sampling rate, and the operating conditions.

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MAX12931EASA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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