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MAX13047EEVB+T - Analog Devices

Description: Translation - Voltage Levels Single- and Dual-Channel, Bidirectional Low-Level Translators

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PCB Footprints
MAX13047EEVB+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - V101A1CN+1
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3D Models
MAX13047EEVB+T - Analog Devices  - 3D model - Quad Flat No-Lead - V101A1CN+1
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MAX13047EEVB+T Details

  • Manufacturer Part Number:

    MAX13047EEVB+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    10-LFCSP-1.4X1.8X0.5

  • Package Description:

    UTQFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    10-LFCSP-1.4X1.8X0.5

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2008-05-22

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Delay-Max:

    1000 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-XQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    1.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.06X.07,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.4 mm

MAX13047EEVB+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX13047EEVB+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals to minimize noise and interference.
  • To configure the MAX13047EEVB+T for a specific application, you'll need to consider factors such as the input voltage range, output voltage, and current requirements. You can use the device's adjustable output voltage feature to set the output voltage to the desired level. Additionally, you can use the device's power-saving features, such as the shutdown mode, to reduce power consumption in battery-powered devices.
  • The MAX13047EEVB+T has a maximum junction temperature of 150°C, and it's essential to ensure that the device operates within this temperature range to prevent thermal shutdown. To ensure reliable operation in high-temperature environments, you can use thermal design techniques such as heat sinking, thermal vias, and thermal interface materials. Additionally, you can use the device's thermal monitoring feature to detect overheating and take corrective action.
  • To troubleshoot common issues with the MAX13047EEVB+T, you can use a combination of visual inspection, measurement tools, and debugging techniques. For example, you can use a multimeter to measure the input and output voltages, and an oscilloscope to measure the output voltage ripple. You can also use the device's built-in diagnostic features, such as the fault flag, to identify the source of the issue.
  • The MAX13047EEVB+T is designed to meet the EMI and EMC requirements of various regulatory standards, such as CISPR and FCC. To ensure compliance, you can use EMI-reducing design techniques such as shielding, filtering, and grounding. Additionally, you can use the device's built-in EMI-reducing features, such as the spread-spectrum clocking, to minimize electromagnetic interference.

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MAX13047EEVB+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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