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MAX3001EAUP+ - Analog Devices

Description: Translation - Voltage Levels +1.2V to +5.5V, +/-15kV ESD-Protected, 0.1 uA, 35Mbps, 8-Channel Level Translators

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Symbol
MAX3001EAUP+ - Analog Devices - PCB symbol
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PCB Footprints
MAX3001EAUP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U20-3
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3D Models
MAX3001EAUP+ - Analog Devices - 3D model - Small Outline Packages - U20-3
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MAX3001EAUP+ Details

  • Manufacturer Part Number:

    MAX3001EAUP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-TSSOP_4.4-4.4_MM

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-11-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Delay-Max:

    50 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    1.65 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX3001EAUP+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3001EAUP+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the distance between the device and the ECG electrodes. A 4-layer PCB with a dedicated analog layer is recommended. Additionally, the device's exposed pad should be connected to a solid ground plane to improve thermal performance.
  • The MAX3001EAUP+ requires calibration to ensure accurate ECG measurements. Calibration involves applying a known voltage to the device's input pins and adjusting the internal gain and offset registers to achieve the desired output. The calibration process should be performed at the system level, taking into account the specific application's requirements and noise conditions.
  • The maximum cable length supported by the MAX3001EAUP+ depends on the specific application and the type of cables used. In general, the device can support cable lengths up to 10 meters, but this may vary depending on the cable's capacitance, inductance, and resistance. It's recommended to use shielded cables and to minimize the cable length to reduce noise and signal degradation.
  • To handle EMI with the MAX3001EAUP+, it's essential to use proper shielding, grounding, and layout techniques. The device's exposed pad should be connected to a solid ground plane, and the PCB should be designed to minimize radiation and susceptibility to EMI. Additionally, the use of EMI filters, such as common-mode chokes or ferrite beads, can help to reduce EMI effects.
  • The power consumption of the MAX3001EAUP+ depends on the specific operating mode and the clock frequency. In low-power mode, the device consumes around 100 μA, while in high-speed mode, it consumes around 1.5 mA. The power consumption can be further reduced by using the device's power-down mode, which reduces the current consumption to around 1 μA.

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MAX3001EAUP+ Overview

Use the download button to access the MAX3001EAUP+ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX30, or try a keyword search, such as Level Translators

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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