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MAX3051EKA+T - Analog Devices

Description: 1Mbps Low-Supply Current CAN Transceiver Maxim MAX3051EKA+T, CAN Transceiver 1MBps 1-channel ISO 11898, 8-Pin SOT-23

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PCB Footprints
MAX3051EKA+T - Analog Devices PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - 21-00078 (8L,SOT-23)
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MAX3051EKA+T - Analog Devices  - 3D model - SOT23 (8-Pin) - 21-00078 (8L,SOT-23)
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MAX3051EKA+T Details

  • Manufacturer Part Number:

    MAX3051EKA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOT_23-N/A

  • Package Description:

    LSSOP, TSSOP8,.1

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOT_23-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-05-20

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

MAX3051EKA+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3051EKA+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, using a shielded enclosure and keeping the device away from high-frequency sources can help minimize EMI and noise.
  • To ensure accuracy, it's essential to calibrate the device, use a high-precision voltage reference, and minimize thermal gradients on the PCB. Additionally, using a thermocouple with a high-temperature coefficient and a low-thermal-mass design can help improve accuracy.
  • The maximum cable length for the MAX3051EKA+T's thermocouple input depends on the type of thermocouple and the noise environment. As a general rule, keep the cable length as short as possible (less than 10 feet) to minimize noise pickup and ensure accurate measurements.
  • While the MAX3051EKA+T is optimized for thermocouple inputs, it can be used with thermistors or RTDs with some modifications. However, this would require additional circuitry and calibration, and the accuracy may not be as high as with a thermocouple.
  • The MAX3051EKA+T has an internal CJC circuit, but it's essential to ensure that the device is properly calibrated and that the CJC is accurate. This can be done by using a high-precision temperature sensor for the CJC and calibrating the device according to the datasheet.

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MAX3051EKA+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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