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MAX31722MUA+ - Analog Devices

Description: Digital Thermometers and Thermostats with SPI/3-Wire Interface

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MAX31722MUA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX31722MUA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U8+1
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3D Models
MAX31722MUA+ - Analog Devices - 3D model - Small Outline Packages - U8+1
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MAX31722MUA+ Details

  • Manufacturer Part Number:

    MAX31722MUA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-MINI_SO-N/A

  • Package Description:

    UMAX-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • Date Of Intro:

    2010-11-16

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Accuracy-Max (Cel):

    2 Cel

  • Body Breadth:

    3 mm

  • Body Height:

    0.85 mm

  • Body Length or Diameter:

    3 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    12

  • Number of Terminals:

    8

  • Operating Current-Max:

    1.2 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Interface Type:

    3-WIRE INTERFACE/SPI INTERFACE

  • Output Voltage-Max:

    2.6 V

  • Output Voltage-Min:

    0.4 V

  • Package Equivalence Code:

    TSSOP8,.2

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    3.7 V

  • Supply Voltage-Min:

    1.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Termination Type:

    SOLDER

MAX31722MUA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31722MUA+ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. A minimum of 10uF input capacitance and 22uF output capacitance is recommended. Also, avoid using capacitors with high ESL (Equivalent Series Inductance).
  • The MAX31722MUA+ can handle input voltages up to 40V, but it's recommended to keep the input voltage below 36V to ensure reliable operation and to prevent damage to the device.
  • The MAX31722MUA+ is rated for operation up to 125°C, but it's recommended to derate the output current and input voltage as the temperature increases to ensure reliable operation. Consult the datasheet for specific derating guidelines.
  • To troubleshoot issues with the MAX31722MUA+, start by checking the input voltage, output voltage, and output current. Verify that the input and output capacitors are properly connected and of the correct value. Check for any signs of overheating, such as excessive temperature or burning smells. Consult the datasheet and application notes for specific troubleshooting guidelines.

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MAX31722MUA+ Overview

Use the download button to access the MAX31722MUA+ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX31, or try a keyword search, such as Temperature Sensors

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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