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MAX31725MTA+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX31725MTA+T - Temperature Sensor IC, Digital, ± 0.7°C, -55 °C, 150 °C, TDFN, 8 Pins

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MAX31725MTA+T - Analog Devices - PCB symbol
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MAX31725MTA+T - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - T833+2
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MAX31725MTA+T - Analog Devices - 3D model - Small Outline No-lead - T833+2
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MAX31725MTA+T Details

  • Manufacturer Part Number:

    MAX31725MTA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-LFCSP-3X3X0.75

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • Date Of Intro:

    2012-10-05

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Accuracy-Max (Cel):

    0.7 Cel

  • Body Breadth:

    3 mm

  • Body Height:

    0.75 mm

  • Body Length or Diameter:

    3 mm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    8

  • Operating Current-Max:

    0.925 mA

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT

  • Supply Voltage-Max:

    3.7 V

  • Supply Voltage-Min:

    2.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Termination Type:

    SOLDER

MAX31725MTA+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31725MTA+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 1uF to 10uF, while the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value between 1uF to 22uF. The capacitor values and types should be chosen based on the specific application requirements and the device's operating frequency.
  • The MAX31725MTA+T has an operating ambient temperature range of -40°C to +125°C, but the device's performance and reliability may be affected at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance.
  • The MAX31725MTA+T has a specific power-up and power-down sequence that should be followed to ensure proper operation. The device should be powered up by applying the input voltage to the VIN pin, followed by the enable signal to the EN pin. During power-down, the enable signal should be removed before the input voltage is removed.
  • The MAX31725MTA+T has a maximum output current capability of 500mA, but the actual output current may be limited by the device's thermal performance, input voltage, and output voltage. It's recommended to operate the device within a safe operating area to ensure reliability and prevent overheating.

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MAX31725MTA+T Overview

Use the download button to access the MAX31725MTA+T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX31, or try a keyword search, such as Temperature Sensors

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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