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MAX31856MUD+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX31856MUD+ - TEMPERATURE SENSOR, 2DEG C, TSSOP-14

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MAX31856MUD+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MAX31856MUD+
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MAX31856MUD+ Details

  • Manufacturer Part Number:

    MAX31856MUD+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-TSSOP_4.4-4.4_MM

  • Package Description:

    ROHS COMPLIANT, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.50

  • Date Of Intro:

    2015-04-06

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX31856MUD+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31856MUD+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the RTD inputs and the digital signals. A 4-layer PCB with a dedicated analog layer is recommended. Additionally, the RTD inputs should be routed as differential pairs, and the digital signals should be routed away from the analog signals.
  • The MAX31856MUD+ has an internal CJC sensor, but it's recommended to use an external CJC sensor for higher accuracy. The external CJC sensor should be connected to the CJCIN pin, and the internal CJC sensor should be disabled by setting the CJCE bit in the configuration register to 0. The CJC temperature reading can be used to compensate for the temperature error in the RTD measurement.
  • The maximum cable length for the RTD inputs of the MAX31856MUD+ depends on the type of cable, the RTD sensor, and the noise environment. As a general rule, the cable length should be kept as short as possible to minimize noise pickup and signal attenuation. A good practice is to keep the cable length below 10 meters, and use shielded twisted-pair cables with a low capacitance per unit length.
  • The MAX31856MUD+ requires calibration for the specific RTD sensor being used. The calibration process involves measuring the RTD resistance at multiple temperatures, and then programming the calibration coefficients into the device. The calibration coefficients can be calculated using the RTD sensor's datasheet and the MAX31856MUD+ datasheet. The calibration process can be done using the device's built-in calibration mode or through software calibration.
  • The recommended power-up sequence for the MAX31856MUD+ is to power up the VDD pin first, followed by the VLOGIC pin. The power-up sequence should be controlled to ensure that the VDD pin reaches its minimum operating voltage before the VLOGIC pin is powered up. A power-up sequence with a delay of at least 10ms between the VDD and VLOGIC pins is recommended.

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MAX31856MUD+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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