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MAX3392EEUD+T - Analog Devices

Description: Translation - Voltage Levels 15kV ESD-Protected, 1 A, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSP

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MAX3392EEUD+T - Analog Devices - PCB symbol
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MAX3392EEUD+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP_14=-
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MAX3392EEUD+T - Analog Devices - 3D model - Small Outline Packages - TSSOP_14=-
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MAX3392EEUD+T Details

  • Manufacturer Part Number:

    MAX3392EEUD+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-TSSOP_4.4-4.4_MM

  • Package Description:

    TSSOP, TSSOP14,.25

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4-4.4_MM

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-01-03

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

  • Delay-Max:

    1600 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX3392EEUD+T Frequently Asked Questions (FAQs)

  • A good PCB layout practice for the MAX3392EEUD+T is to keep the analog and digital grounds separate, use a solid ground plane, and place the device close to the connector to minimize trace lengths. Additionally, use a ferrite bead or a 10Ω resistor in series with the VCC pin to filter out high-frequency noise.
  • To ensure proper power-up and configuration, make sure to follow the recommended power-up sequence in the datasheet. Apply VCC first, followed by VLOGIC, and then the input signals. Also, ensure that the EN pin is high during power-up to enable the device.
  • The maximum cable length supported by the MAX3392EEUD+T depends on the specific application and signal frequency. As a general guideline, the device can support cable lengths up to 10 meters at 100Mbps. However, signal integrity may be affected by cable length, so it's essential to use proper termination and signal conditioning techniques to maintain signal quality.
  • To troubleshoot signal distortion or data corruption issues, start by checking the PCB layout and signal routing for any potential sources of noise or interference. Verify that the device is properly powered and configured, and that the input signals are within the recommended specifications. Use an oscilloscope to analyze the signal waveforms and identify any anomalies. If necessary, use a signal integrity tool or simulation software to model the signal transmission and identify potential issues.
  • Yes, the MAX3392EEUD+T has a maximum junction temperature of 150°C. To ensure reliable operation, especially in high-temperature environments, it's essential to provide adequate thermal management. Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, consider using a thermally conductive PCB material and follow proper PCB design guidelines for thermal management.

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MAX3392EEUD+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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