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MAX3736ETE+T - Analog Devices

Description: 3.2Gbps, Low-Power, Compact, SFP Laser Driver

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PCB Footprints
MAX3736ETE+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T1633+2
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MAX3736ETE+T - Analog Devices  - 3D model - Quad Flat No-Lead - T1633+2
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MAX3736ETE+T Details

  • Manufacturer Part Number:

    MAX3736ETE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    16-LFCSP-3X3X0.75

  • Package Description:

    HVQCCN, LCC16,.12SQ,20

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-LFCSP-3X3X0.75

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2004-02-03

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX3736ETE+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3736ETE+T involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper powering and decoupling, connect the VCC pin to a clean, low-noise power supply, and decouple it with a 0.1uF ceramic capacitor to GND. Additionally, place a 10uF electrolytic capacitor in parallel with the 0.1uF capacitor to filter out low-frequency noise.
  • The MAX3736ETE+T can support data rates up to 3.2Gbps, making it suitable for high-speed applications such as HDMI, DisplayPort, and USB 3.0.
  • The MAX3736ETE+T has a programmable output swing level, which can be set using the VOS pin. By connecting VOS to VCC, GND, or a resistive divider, you can set the output swing level to 400mV, 200mV, or a custom level, respectively.
  • The typical power consumption of the MAX3736ETE+T is around 130mW at 3.3V supply voltage and 3.2Gbps data rate. However, this can vary depending on the specific application and operating conditions.

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MAX3736ETE+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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