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MAX539BCSA+ - Analog Devices

Description: MAX539BCSA+, 12 bit-Bit DAC SPI, 8-Pin SOIC

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MAX539BCSA+ - Analog Devices - PCB symbol
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MAX539BCSA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - soic8-ren3
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MAX539BCSA+ Details

  • Manufacturer Part Number:

    MAX539BCSA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    0.150 INCH, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    1999-05-25

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Settling Time-Nom (tstl):

    25 µs

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX539BCSA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX539BCSA+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply bypass capacitors. Additionally, it's recommended to use a Kelvin connection for the output voltage sense lines to minimize noise and ensure accurate voltage sensing.
  • To ensure stability, it's essential to follow the recommended compensation network and component values provided in the datasheet. Additionally, the output capacitor should be chosen based on the output voltage and current requirements, and the device should be operated within its specified operating conditions.
  • The MAX539BCSA+ has a maximum output current capability of 500mA. However, the actual output current capability may be limited by the thermal performance of the device and the PCB, as well as the input voltage and output voltage requirements.
  • The MAX539BCSA+ is rated for operation up to 125°C. However, the device's performance and reliability may be affected at high temperatures. It's essential to follow the recommended operating conditions and derate the device's performance accordingly.
  • To troubleshoot issues with the MAX539BCSA+, start by verifying the input voltage, output voltage, and output current. Check for proper PCB layout, component values, and soldering quality. Use an oscilloscope to check for oscillations or noise on the output, and consult the datasheet and application notes for guidance.

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MAX539BCSA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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