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MAX5715AAUD+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX5715AAUD+ - DAC, 12BIT, QUAD, TSSOP-14

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MAX5715AAUD+ - Analog Devices - PCB symbol
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MAX5715AAUD+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - Max 21-0066_M (14 TSSOP)
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MAX5715AAUD+ - Analog Devices - 3D model - Small Outline Packages - Max 21-0066_M (14 TSSOP)
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MAX5715AAUD+ Details

  • Manufacturer Part Number:

    MAX5715AAUD+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-TSSOP_4.4-4.4_MM

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2012-07-26

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Linearity Error-Max (EL):

    0.024%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    1.5 mA

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MAX5715AAUD+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX5715AAUD+ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, the device should be placed near the power source to minimize voltage drops.
  • To ensure the MAX5715AAUD+ is stable and does not oscillate, it is recommended to follow the layout and placement guidelines, use a sufficient output capacitor (at least 10uF), and ensure that the input voltage is within the recommended range. Additionally, the device should be decoupled from the power source using a 10uF capacitor and a 1Ω resistor in series.
  • The maximum input voltage that can be applied to the MAX5715AAUD+ is 5.5V. Exceeding this voltage can cause damage to the device. It is recommended to use a voltage regulator or a voltage limiter to ensure the input voltage remains within the recommended range.
  • The output voltage of the MAX5715AAUD+ can be programmed using an external resistor divider network connected to the FB pin. The output voltage is determined by the ratio of the resistors and the internal reference voltage. The datasheet provides a formula to calculate the output voltage based on the resistor values.
  • The thermal derating of the MAX5715AAUD+ is 12mW/°C above 25°C. This means that the device's power dissipation should be reduced by 12mW for every degree Celsius above 25°C to prevent overheating and ensure reliable operation.

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MAX5715AAUD+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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