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MAX5725BAUP+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX5725BAUP+ - DAC, 12BIT, OCTAL, TSSOP-20

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Symbol
MAX5725BAUP+ - Analog Devices - PCB symbol
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PCB Footprints
MAX5725BAUP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP 16
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3D Models
MAX5725BAUP+ - Analog Devices - 3D model - Small Outline Packages - TSSOP 16
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MAX5725BAUP+ Details

  • Manufacturer Part Number:

    MAX5725BAUP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-TSSOP_4.4-4.4_MM

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2012-04-12

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Linearity Error-Max (EL):

    0.024%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    8

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    2.5 mA

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MAX5725BAUP+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX5725BAUP+ involves placing the device close to the power source, using a solid ground plane, and keeping the input and output traces short and wide to minimize noise and EMI. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the MAX5725BAUP+ operates within its specified temperature range, provide adequate heat sinking, avoid overheating, and keep the device away from high-temperature sources. The device's thermal pad should be connected to a solid ground plane or a heat sink to dissipate heat efficiently.
  • The recommended input capacitor value for the MAX5725BAUP+ is 10uF to 22uF, with a voltage rating of at least 25V. A low-ESR capacitor is recommended to minimize noise and ensure stable operation.
  • To troubleshoot issues with the MAX5725BAUP+, start by checking the input voltage, output voltage, and current. Verify that the device is properly connected and that the input and output capacitors are of the correct value and type. Check for overheating, noise, and EMI issues. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the MAX5725BAUP+ is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q100 and is designed to operate in harsh environments. However, it is essential to follow proper design and manufacturing guidelines to ensure the device meets the specific requirements of the application.

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MAX5725BAUP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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