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MAX6010BEUR+T - Analog Devices

Description: Precision, Micropower, 3V Series Voltage Reference

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MAX6010BEUR+T - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - sot-23
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MAX6010BEUR+T - Analog Devices  - 3D model - SOT23 (3-Pin) - sot-23
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MAX6010BEUR+T Details

  • Manufacturer Part Number:

    MAX6010BEUR+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    3-SOT_23-N/A

  • Package Description:

    ROHS COMPLIANT, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    3-SOT_23-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2009-05-27

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    3.012 V

  • Output Voltage-Min:

    2.988 V

  • Output Voltage-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temp Coef of Voltage-Max:

    50 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.4%

  • Width:

    1.3 mm

MAX6010BEUR+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX6010BEUR+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure the accuracy of the voltage reference output, it is essential to decouple the input pin (VIN) with a 10uF capacitor, use a low-ESR capacitor for the output capacitor (COUT), and keep the output current within the recommended range (1mA to 10mA).
  • The MAX6010BEUR+T is a temperature-compensated voltage reference, which means its output voltage remains stable over a wide temperature range (-40°C to +125°C). However, the output voltage may vary by ±1mV/°C due to thermal drift.
  • No, the MAX6010BEUR+T is a voltage reference, not a voltage regulator. It is designed to provide a stable voltage reference output, but it does not have the capability to regulate an output voltage based on an input voltage.
  • To protect the MAX6010BEUR+T from overvoltage and undervoltage conditions, use a voltage clamp or a transient voltage suppressor (TVS) diode on the input pin (VIN). Additionally, ensure that the input voltage is within the recommended range (2.7V to 5.5V).

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MAX6010BEUR+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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