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MAX7301ATL+ - Analog Devices

Description: Maxim MAX7301ATL+, IO Controller 28-USB, 40-Pin TQFN

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MAX7301ATL+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MAX7301ATL+
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MAX7301ATL+ - Analog Devices  - 3D model - Quad Flat No-Lead - MAX7301ATL+
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MAX7301ATL+ Details

  • Manufacturer Part Number:

    MAX7301ATL+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    40-LFCSP-6X6X0.75

  • Package Description:

    TQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    40-LFCSP-6X6X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-05-16

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Clock Frequency-Max:

    26 MHz

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    28

  • Number of Ports:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.25SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.27 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    PARALLEL IO PORT, GENERAL PURPOSE

MAX7301ATL+ Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the MAX7301ATL+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the MAX7301ATL+ is properly powered up and initialized, make sure to follow the power-up sequence specified in the datasheet, which involves applying VCC before applying VLOGIC. Also, ensure that the device is properly reset by asserting the RESET pin low for at least 10ns.
  • The maximum capacitance value that can be used with the MAX7301ATL+ is 10uF. Using a capacitance value higher than this may cause the device to oscillate or malfunction.
  • To troubleshoot issues with the MAX7301ATL+, start by checking the power supply voltages and ensuring that they are within the specified range. Then, check the reset pin and ensure that it is properly asserted low during power-up. Finally, use a logic analyzer or oscilloscope to verify that the device is properly communicating with the microcontroller.
  • Yes, the MAX7301ATL+ can be used in a hot-swappable application, but it requires careful consideration of the power-up and power-down sequences to ensure that the device is properly initialized and reset. Additionally, the device's power pins should be protected with TVS diodes to prevent damage from voltage transients.

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MAX7301ATL+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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