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MAXM22511GLH+ - Analog Devices

Description: 2.5kVRMS Complete Isolated RS-485/RS-422 Module Transceiver + Power

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MAXM22511GLH+ - Analog Devices - PCB symbol
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PCB Footprints
MAXM22511GLH+ - Analog Devices PCB footprint - Other - Other - MAXM22511GLH+
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3D Models
MAXM22511GLH+ - Analog Devices - 3D model - Other - MAXM22511GLH+
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MAXM22511GLH+ Details

  • Manufacturer Part Number:

    MAXM22511GLH+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    44-LGA-9.35X11.5X2.82

  • Package Description:

    LGA-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    44-LGA-9.35X11.5X2.82

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-10-18

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; TIA-485; EIA-422

  • JESD-30 Code:

    R-XBGA-N44

  • Length:

    11.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.004 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    FBGA

  • Package Equivalence Code:

    LCC44,.36X.45,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Receive Delay-Max:

    240 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    2.92 mm

  • Supply Current-Max:

    44 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Transmit Delay-Max:

    1040 ns

  • Width:

    9.35 mm

MAXM22511GLH+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAXM22511GLH+ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, connect the EN pin to a valid logic level, and configure the device using the SPI interface. Also, make sure to follow the recommended voltage and current ratings for the device.
  • The MAXM22511GLH+ is rated for operation from -40°C to +125°C, but the device's performance may degrade at extreme temperatures. It's essential to ensure proper thermal management and heat dissipation to maintain optimal performance.
  • To troubleshoot SPI interface issues, check the clock frequency, clock polarity, and clock phase settings. Ensure that the slave select pin is properly configured and that the SPI bus is not overloaded. Use a logic analyzer or oscilloscope to verify the SPI signals.
  • To protect the MAXM22511GLH+ from electrostatic discharge (ESD), use ESD-sensitive handling procedures, store the device in an anti-static bag or container, and use ESD protection devices such as TVS diodes or ESD arrays on the PCB.

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MAXM22511GLH+ Overview

Use the download button to access the MAXM22511GLH+ schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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