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MC33910G5ACR2 - NXP

Description: LIN System Basis Chip with High Side Drivers

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PCB Footprints
MC33910G5ACR2 - NXP PCB footprint - Other - Other - QFP80P900X900X160-32N
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3D Models
MC33910G5ACR2 - NXP  - 3D model - Other - QFP80P900X900X160-32N
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MC33910G5ACR2 Details

  • Manufacturer Part Number:

    MC33910G5ACR2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    0.11 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    10 µs

  • Turn-on Time:

    10 µs

  • Width:

    7 mm

MC33910G5ACR2 Frequently Asked Questions (FAQs)

  • The internal voltage regulator of the MC33910G5ACR2 is rated for a maximum current of 150mA.
  • To configure the device for low-power mode, set the EN pin low and ensure that the VREG pin is connected to a voltage source. Additionally, disable any unused peripherals and set the clock frequency to the lowest possible value.
  • For optimal performance, it is recommended to use a solid ground plane and to route the power pins (VDD, VREG, and GND) as close to the device as possible. Avoid routing power traces near sensitive analog signals.
  • To troubleshoot issues with the internal oscillator, check the XTAL1 and XTAL2 pins for proper connection and termination. Ensure that the oscillator frequency is within the specified range (typically 4-20MHz). Also, check the OSCEN bit in the SYSCFG1 register to ensure that the oscillator is enabled.
  • The MC33910G5ACR2 is rated for operation over a temperature range of -40°C to +125°C.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image MC33910G5ACR2 Freescale Semiconductor

Buffer/Inverter Based Peripheral Driver, 0.11A, PQFP32