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MC33996EKR2 - NXP

Description: Power Switch/Driver 1:16 N-Channel 900mA 32-SOIC

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MC33996EKR2 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 32-PIN SOICW EP 98ARL10543D REVISION C
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MC33996EKR2 - NXP  - 3D model - Small Outline Packages - 32-PIN SOICW EP 98ARL10543D REVISION C
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MC33996EKR2 Details

  • Manufacturer Part Number:

    MC33996EKR2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    11 X 7.50 MM, 0.65 MM PITCH, LEAD FREE, SOIC-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    SIPO BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • Length:

    11 mm

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    27 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    10 µs

  • Turn-on Time:

    10 µs

  • Width:

    7.5 mm

MC33996EKR2 Frequently Asked Questions (FAQs)

  • The maximum current rating of the MC33996EKR2 is 2.5A per channel, with a maximum total current of 5A.
  • The MC33996EKR2 can be configured for high-side or low-side switching by connecting the appropriate pins to the load and power supply. For high-side switching, connect the load to the VOUT pin and the power supply to the VIN pin. For low-side switching, connect the load to the VIN pin and the power supply to the VOUT pin.
  • The EN (enable) pin is used to enable or disable the device. When the EN pin is high, the device is enabled and the outputs are active. When the EN pin is low, the device is disabled and the outputs are in a high-impedance state.
  • The MC33996EKR2 has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. The OVP circuit limits the input voltage to 18V, and the UVP circuit disables the device when the input voltage falls below 6V. Additionally, external protection circuits can be added to provide additional protection.
  • The thermal shutdown temperature of the MC33996EKR2 is 150°C. If the junction temperature exceeds this value, the device will shut down to prevent damage.

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MC33996EKR2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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