MC68L11E1FNE2 - NXP

MC68L11E1FNE2 Details

• Manufacturer Part Number:

  MC68L11E1FNE2

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  PLASTIC, LCC-52

• ECCN Code:

  EAR99

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  52 Weeks

• Date Of Intro:

  1988-01-01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  YES

• Address Bus Width:

  16

• Bit Size:

  8

• Clock Frequency-Max:

  8 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• External Data Bus Width:

  8

• JESD-30 Code:

  S-PQCC-J52

• JESD-609 Code:

  e3

• Length:

  19.1262 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  38

• Number of Terminals:

  52

• Operating Temperature-Max:

  70 °C

• Operating Temperature-Min:

  -20 °C

• PWM Channels:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  QCCJ

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER

• Peak Reflow Temperature (Cel):

  250

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  4.57 mm

• Speed:

  2 MHz

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  HCMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  J BEND

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  19.1262 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER