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MC7447AHX1000NB - NXP

Description: MPU PowerPC MPC74xx Processor RISC 32-Bit 0.13um 1GHz 1.8V/2.5V 360-Pin FCCBGA Tray

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MC7447AHX1000NB - NXP - PCB symbol
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MC7447AHX1000NB - NXP PCB footprint - BGA - BGA - SOT1603-1
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MC7447AHX1000NB Details

  • Manufacturer Part Number:

    MC7447AHX1000NB

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 1.8V OR 2.5V SUPPLY

  • Address Bus Width:

    36

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    167 MHz

  • External Data Bus Width:

    64

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-CBGA-B360

  • JESD-609 Code:

    e0

  • Length:

    25 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    360

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.24 mm

  • Speed:

    1000 MHz

  • Supply Voltage-Max:

    1.35 V

  • Supply Voltage-Min:

    1.25 V

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    25 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

MC7447AHX1000NB Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC7447AHX1000NB should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good airflow around the component. Use thermal vias to dissipate heat from the top layer to the bottom layer. Keep the component away from other heat sources and ensure a clear path for airflow.
  • To ensure EMC compliance, follow proper PCB design and layout guidelines. Use a multi-layer PCB with a solid ground plane, and keep sensitive analog and digital traces separate. Use shielding and filtering components as needed. Ensure proper decoupling and bypassing of power supplies. Consult the NXP application note AN11160 for more information.
  • The recommended power-up sequence is to apply the analog power supply (VCC) first, followed by the digital power supply (VDD). During power-down, reverse the sequence. Ensure that the power supplies are ramped up and down slowly to prevent damage to the device.
  • The internal voltage regulator is enabled by default. If you want to use an external voltage regulator, connect the VREG pin to the external regulator output. Ensure the external regulator can provide the required current and voltage. Consult the datasheet for specific voltage and current requirements.
  • The MC7447AHX1000NB has a maximum junction temperature of 150°C. Ensure good airflow around the device, and use a heat sink or thermal pad if necessary. Use thermal interface materials to improve heat transfer. Consult the NXP application note AN11160 for more information on thermal design.

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MC7447AHX1000NB Overview

Use the download button to access the MC7447AHX1000NB schematic symbol and PCB footprint.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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