25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360
Country Of Origin:
Malaysia
ECCN Code:
3A991.A.1
HTS Code:
8542.31.00.01
Manufacturer:
NXP Semiconductors
YTEOL:
0
Address Bus Width:
36
Bit Size:
32
Boundary Scan:
YES
Clock Frequency-Max:
200 MHz
External Data Bus Width:
64
Format:
FLOATING POINT
Integrated Cache:
YES
JESD-30 Code:
S-CBGA-B360
JESD-609 Code:
e0
Length:
25 mm
Low Power Mode:
YES
Moisture Sensitivity Level:
1
Number of Terminals:
360
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
CERAMIC, METAL-SEALED COFIRED
Package Code:
BGA
Package Equivalence Code:
BGA360,19X19,50
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
2.8 mm
Speed:
1267 MHz
Supply Voltage-Max:
1.1 V
Supply Voltage-Min:
1 V
Supply Voltage-Nom:
1.05 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin/Lead (Sn/Pb)
Terminal Form:
BALL
Terminal Pitch:
1.27 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
40
Width:
25 mm
uPs/uCs/Peripheral ICs Type:
MICROPROCESSOR, RISC
MC7448THX1267ND Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper airflow and avoid thermal hotspots.
Critical timing parameters include tCK (clock cycle time), tRAS (row address strobe), tRCD (RAS to CAS delay), and tWR (write recovery time). Refer to the DDR3 specification for detailed timing requirements.
Use the device's power management features, such as dynamic voltage and frequency scaling, and implement a power gating strategy. Optimize software to minimize power consumption during idle periods.
Configure the memory controller for the specific DDR3 memory module used. Set the memory timing parameters, such as CAS latency, RAS to CAS delay, and write recovery time, according to the module's specifications.
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MC7448THX1267ND Overview
Use the download button to access the MC7448THX1267ND 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About NXP
NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more.
NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.
