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MC79M15BDTG - onsemi

Description: LDO Regulator, 500 mA, 5 V, Negative 4%; TJ = -40°C to +125°C

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MC79M15BDTG - onsemi  - 3D model
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MC79M15BDTG Details

  • Manufacturer Part Number:

    MC79M15BDTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    1.1 V

  • Input Voltage Absolute-Max:

    35 V

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    17.5 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Length:

    6.54 mm

  • Line Regulation-Max:

    0.08%

  • Load Regulation-Max:

    0.24%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    2

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    15.75 V

  • Output Voltage1-Min:

    14.25 V

  • Output Voltage1-Nom:

    15 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED NEGATIVE SINGLE OUTPUT STANDARD REGULATOR

  • Seated Height-Max:

    2.38 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.29 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tolerance-Max:

    4%

  • Width:

    6.095 mm

MC79M15BDTG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Exceeding the maximum junction temperature (Tj) can lead to reduced lifespan, decreased performance, and potential device failure. Ensure the system design keeps the junction temperature below the recommended maximum of 150°C.
  • Implement ESD protection measures, such as using ESD-sensitive handling procedures, incorporating ESD protection devices (e.g., TVS diodes), and designing the PCB with ESD protection in mind.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s max. For rework, use a low-temperature soldering iron (< 350°C) and minimize the number of rework cycles.

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MC79M15BDTG Overview

Use the download button to access the MC79M15BDTG 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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