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MC9S08DZ60ACLF - NXP

Description: HCS08 Microcontrollers

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PCB Footprints
MC9S08DZ60ACLF - NXP PCB footprint - Other - Other - QFP50P900X900X160-48N-ren1
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3D Models
MC9S08DZ60ACLF - NXP  - 3D model - Other - QFP50P900X900X160-48N-ren1
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MC9S08DZ60ACLF Details

  • Manufacturer Part Number:

    MC9S08DZ60ACLF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Has ADC:

    NO

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    MC9S08

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    40

  • Number of Terminals:

    48

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    4192

  • ROM (words):

    61440

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    40 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MC9S08DZ60ACLF Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 20 MHz. However, it's recommended to use a crystal oscillator or an external clock source for more accurate and stable clocking.
  • To configure the ADC to convert analog signals from multiple channels, you need to use the ADC's scan mode. This mode allows you to convert multiple channels in a sequence. You can configure the ADC to scan through multiple channels by setting the ADCSC2 register and enabling the ADCSC1[ADIC] bit.
  • The COP watchdog timer is a safety feature that resets the microcontroller if it fails to periodically reset the COP timer. This ensures that the microcontroller is operating properly and prevents it from getting stuck in an infinite loop or malfunctioning.
  • To use the SCI module for asynchronous communication, you need to configure the SCI module in asynchronous mode by setting the SCI0C1[TE] and SCI0C1[RE] bits. You also need to set the baud rate, data bits, parity, and stop bits using the SCI0BDH and SCI0BDL registers.
  • The TPM module is a 16-bit timer that can be used for various applications such as generating PWM signals, measuring pulse widths, and counting events. It can also be used as a timer for generating interrupts at specific intervals.

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MC9S08DZ60ACLF Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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