MC9S08QG8CPBE - NXP

MC9S08QG8CPBE Details

• Manufacturer Part Number:

  MC9S08QG8CPBE

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  ROHS COMPLIANT, PLASTIC, DIP-16

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  YES

• Bit Size:

  8

• Boundary Scan:

  YES

• Clock Frequency-Max:

  20 MHz

• DAC Channels:

  YES

• DMA Channels:

  NO

• JESD-30 Code:

  R-PDIP-T16

• JESD-609 Code:

  e3

• Length:

  19.175 mm

• Number of I/O Lines:

  14

• Number of Terminals:

  16

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  DIP

• Package Equivalence Code:

  DIP16,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Qualification Status:

  Not Qualified

• RAM (bytes):

  512

• ROM (words):

  8192

• ROM Programmability:

  FLASH

• Seated Height-Max:

  4.44 mm

• Speed:

  20 MHz

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  3 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Width:

  7.62 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER