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MCIMX27MOP4AR2 - NXP

Description: Not Recommended for New Designs - BONO 19X19 R2Package:LFBGA473, plastic, low profile fine-pitch ball grid array; 473 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.12 mm bodyProduct:i.MX27 Multimedia Applications Processor has an Arm9 Core for High Performance, Connectivity and Robust Security for Mobile designs.

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MCIMX27MOP4AR2 - NXP

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