19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473
Country Of Origin:
Mainland China
ECCN Code:
5A992.C
HTS Code:
8542.31.00.01
Factory Lead Time:
13 Weeks
Manufacturer:
NXP Semiconductors
YTEOL:
5
Additional Feature:
UNAVAILABLE FOR IMPORT OR SALE IN US
JESD-30 Code:
S-PBGA-B473
JESD-609 Code:
e1
Length:
14 mm
Moisture Sensitivity Level:
3
Number of Terminals:
473
Operating Temperature-Max:
70 °C
Operating Temperature-Min:
-20 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFBGA
Package Equivalence Code:
BGA473,23X23,32
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.54 mm
Supply Voltage-Max:
1.65 V
Supply Voltage-Min:
1.52 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
OTHER
Terminal Finish:
Nickel/Gold (Ni/Au)
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
40
Width:
14 mm
uPs/uCs/Peripheral ICs Type:
SoC
MCIMX31LDVMN5D Frequently Asked Questions (FAQs)
The recommended crystal oscillator frequency for the MCIMX31LDVMN5D is 24 MHz or 32.768 kHz. However, it's essential to consult the datasheet and application notes for specific configuration and usage guidelines.
The MCIMX31LDVMN5D has a DDR2 interface that requires specific configuration and initialization. Refer to the i.MX31 DDR2 Interface Application Note (AN3944) and the Linux kernel documentation for detailed configuration and initialization guidelines.
The MCIMX31LDVMN5D has an operating temperature range of -40°C to 105°C (industrial grade) and -20°C to 70°C (commercial grade). However, it's essential to consult the datasheet and reliability reports for specific temperature-related specifications and guidelines.
The MCIMX31LDVMN5D has a High-Assurance Boot (HAB) mechanism that enables secure boot. Refer to the i.MX31 High-Assurance Boot (HAB) User's Guide (AN4038) and the NXP Secure Boot documentation for detailed implementation guidelines.
The MCIMX31LDVMN5D has a dynamic power consumption of approximately 250 mW/MHz (typical) and a standby power consumption of around 10 μW (typical). However, actual power consumption may vary depending on the application, clock frequency, and operating conditions. Consult the datasheet and power management documentation for more information.
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MCIMX31LDVMN5D Overview
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About NXP
NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more.
NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.
