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MCIMX6G3DVK05AA - NXP

Description: ARM® Cortex®-A7 Microprocessor IC series 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9)

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MCIMX6G3DVK05AA - NXP PCB footprint - BGA - BGA - SOT1598-1
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MCIMX6G3DVK05AA - NXP  - 3D model - BGA - SOT1598-1
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MCIMX6G3DVK05AA Details

  • Manufacturer Part Number:

    MCIMX6G3DVK05AA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MAPBGA-272

  • ECCN Code:

    5A992

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B272

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    272

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.23 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.275 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6G3DVK05AA Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to first apply the 1.2V to 1.35V core voltage (VDD_CORE), followed by the 2.5V to 3.3V I/O voltage (VDD_IO). This ensures that the internal voltage regulators are properly enabled and stabilized before the CPU is powered on.
  • The MCIMX6G3DVK05AA has multiple clock sources, including the internal oscillator, external crystal oscillator, and PLLs. The clock sources can be configured using the Clock Control Module (CCM) registers. Refer to the i.MX6 Applications Processor Reference Manual for detailed information on clock configuration.
  • The MCIMX6G3DVK05AA has an operating temperature range of -40°C to 105°C (industrial grade) and 0°C to 70°C (commercial grade). However, it's recommended to operate the device within the specified temperature range to ensure reliable operation and prevent damage.
  • The MCIMX6G3DVK05AA has a built-in Secure Boot mechanism that uses a combination of hardware and software components to ensure the authenticity and integrity of the boot process. Implementing secure boot requires generating and signing boot images using the NXP Code Signing Tool, and configuring the Boot Mode Pins (BMODE) to enable secure boot.
  • The MCIMX6G3DVK05AA has a 32-bit DDR3 interface that supports up to 2GB of RAM. However, the maximum amount of RAM that can be used depends on the specific use case and memory configuration.

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MCIMX6G3DVK05AA Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image MCIMX6G3DVK05AB NXP Semiconductors

SoC, CMOS, PBGA272